Thin Carrier Plate Dipper for lowest cost production of MLCC, etc.
- Low cost per dipped component
- Dipping accuracy 10 microns
- Suited for high volume production
- For 0201 up to 2520 chip sizes
- Capacity up to 800.000 pieces per hour
- Superior dipping results
- Round or diamond shaped holes
- Fast heating and cooling during drying
- Allows two sided dipping
- Very low tooling cost
Thin Carrier Plates
The unique Thin Carrier Plate assures a high chip holding forcewith high centering accuracy. The thin carrier plate requires very low energy consumption during the drying process because of the low thickness and material choice. With an unparalleled number of chips per plate the dipping process is extremely efficient.
Designed for dipping of end terminals on surface mount components. The special design assures a flexible dippingprocess with a high production capacity and high quality terminations. The programmable dipping parameters allow optimization of the paste deposition and reduction of defects. Optional tooling for loading and unloading of components is available for manual and fully automated production.
Technical Specification
Holes: |
496 - 18.128 / plate |
2 side dip: |
> 0603 |
Chip sizes: |
0201 - 2520 (Other chip sizes on request) |
Hole precision: |
± 10 microns |
Paste thickness: |
± 10 microns |
Dipping head positioning: |
± 2 microns |
Ink tray flatness: |
± 5 micron |
HMI: |
Color touch screen (Fully programmable dipping process) |
Vacuum: |
650mm Hg |
Air pressure: |
0.5 MPa |
Size: |
1200 x 1000 x 1950 mm |
Weight: |
700 kg (manual loading) |
How to order
ILS |
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D in case of double pressure vessel size |
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Max. pressure 6 for 6000PSI, 10 for 10000PSI |
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Max. bar size in inch: 4 or 6 or 10 or 12 |
Isostatic Laminator |