Array dipping of MLCC, MLCI, MLV, LTCC etc.
- Very accurate termination position
- Dipping resolution 1 micron
- Blotting function
- Anti airbubble function
- Capacity up to 50.000 pieces per hour
- Superior dipping results
- Diamond shaped holes with ± 15micron position accurac
- Fast heating and cooling during drying
- Lowest energy consumption
- Very low tooling cost
The unique Thin Array Carrier Plate with diamond shaped openings assures a high chip holding force with high centering accuracy. The thin carrier plate requires very low energy consumption during the drying process because of the low thickness and material choice. The drying process is therefore predominantly defined by the paste parameters.
Designed for dipping of array terminations on ceramic components The dedicated design assures a flexible dipping process with a high production capacity and high quality terminations. The programmable dipping parameters allow optimization of the paste deposition and reduction of defect terminations by unique anti air bubble removal functions.
Technical Specification
Holes: |
1030 holes per plate for 0204-0508 |
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704 holes per plate for 0610-0612 |
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Other chip sizes on request |
TACP size: |
152 x 152 mm |
Hole precision: |
± 15 microns |
Paste plate: |
242 x 202 x 15.6 mm |
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Groove size made on request |
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Plate parallelism 10 microns |
Paste Box: |
154 x 124 x 20 mm |
HMI: |
Color touch screen (Fully programmable dipping process) |
Vacuum: |
650mm Hg |
Air pressure: |
0.5 MPa |
Size: |
1200 x 1000 x 1950 mm |
Weight: |
600 kg |
How to order
ILS |
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D in case of double pressure vessel size |
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Max. pressure 6 for 6000PSI, 10 for 10000PSI |
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Max. bar size in inch: 4 or 6 or 10 or 12 |
Isostatic Laminator |