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TACP Array Dipper

TACP Array Dipper

The TACP Array Termination machine is designed to dip multi stripe wrap around contacts on ceramic components. The innovative novel concept assures a flexible dipping process resulting in a high production capacity with high quality terminations. The unique Thin Array Carrier Plate with diamond shaped openings assures a high chip holding force with high centering accuracy.

As it holds 700 to 3000 components in one plate, the process is better controlled and has a higher productivity at a strongly reduced cost. The programmable dipping parameters allow optimization of the paste deposition and reduction of defect terminations by unique anti air bubble removal functions. We offer fully automatic high volume and medium volume line with high flexibility. We encourage our customers to send samples to test our capabilities!


Carrier Plate Dipper

Carrier plate dippers are using FR4 Palomar style carrier plates for the end contact metallization of chip.

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JIG Dipper

Jig plate dippers use FR4 plates which have a sticky tape on one side. This sticky tape holds the chips in its position during the dipping procedure.

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Thin Carrier Plate Dipper

Thin Carrier Plates are the latest and most cost efficient metallization method on the market today. Due to its excellent accuracy the only smallest amount of paste for a sufficient chip metallization is necessary.

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Multistripe TACP Array dipper

The TACP array Termination machine is designed to dip multi stripe wrap around contacts on ceramic components.

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