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JIG Dipper

Carrier Plate Dipper

Jig plate dippers use FR4 plates which have a sticky tape on one side. This sticky tape holds the chips in its position during the dipping procedure.

After the metallization of chips the tape is removed and the chips are being released from the position holes for further processing.

This technology is suitable for flexible production as it avoids high investments in tooling costs and has yet a high flexibility in using different chip sizes. Both sticky tape and JIGs are easily available.


Carrier Plate Dipper

Carrier plate dippers are using FR4 Palomar style carrier plates for the end contact metallization of chip.

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JIG Dipper

Jig plate dippers use FR4 plates which have a sticky tape on one side. This sticky tape holds the chips in its position during the dipping procedure.

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Thin Carrier Plate Dipper

Thin Carrier Plates are the latest and most cost efficient metallization method on the market today. Due to its excellent accuracy the only smallest amount of paste for a sufficient chip metallization is necessary.

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Multistripe TACP Array dipper

The TACP array Termination machine is designed to dip multi stripe wrap around contacts on ceramic components.

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