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MGTL-series Thin Carrier Plate Dipper

Thin Carrier Plate Dipper

Thin Carrier Plates are the latest and most cost efficient metallization method on the market today. Due to its excellent accuracy the only smallest amount of paste for a sufficient chip metallization is necessary.

Thin steel carrier plates are coated with silicone rubber that holds the chips in its position during dipping. All plates can be for repeated use over a long period without a loss of accuracy. Thus except the reusable plates helping to reduce the expenditures for consumables to a minimum there are virtually no additional cost of consumables.

The capacity per machine is by far the highest in the industry leading to the lowest cost of ownership for mass production of chips. Different chip sizes down to 01005 can be processed in the same machine with low change-over times


Carrier Plate Dipper

Carrier plate dippers are using FR4 Palomar style carrier plates for the end contact metallization of chip.

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JIG Dipper

Jig plate dippers use FR4 plates which have a sticky tape on one side. This sticky tape holds the chips in its position during the dipping procedure.

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Thin Carrier Plate Dipper

Thin Carrier Plates are the latest and most cost efficient metallization method on the market today. Due to its excellent accuracy the only smallest amount of paste for a sufficient chip metallization is necessary.

More about our Thin Carrier Plate Dipper


Multistripe TACP Array dipper

The TACP array Termination machine is designed to dip multi stripe wrap around contacts on ceramic components.

More about our TACP Array Dipper